QuadraPure^t AMPA, 350-750 micron, metal scavenger QuadraPure^t AMPA, 350-750 micron, metal scavenge

钆粉, -200目, 99.9% (REO) 7440-54-2 Gadolinium powder, -200 mesh, 99.9% (REO)

钕粉, -200目, 99.9% (REO) 7440-00-8 Neodymium powder, -200 mesh, 99.9% (REO)

镨粉, -200目, 99.9% (REO) 7440-10-0 Praseodymium powder, -200 mesh, 99.9% (REO)

铈粉, -200目, 99.9% (REO) 7440-45-1 Cerium powder, -60 mesh, 99.9% (REO)

镧粉, -200目, 99.9% (REO) 7439-91-0 Lanthanum powder, -200 mesh, 99.9% (REO)

聚(3-己基噻吩-2,5-二基), 区域无规 104934-50-1 Poly(3-hexylthiophene-2,5-diyl), regiorandom

金纳米颗粒, APS 20-25nm, 99.95+% (metals basis) 7440-57-5 Gold nanopowder, APS 20-25nm, 99.95+% (metals b

银粉(Cypher 88) 7440-22-4 Silver powder (Cypher 88)

银粉(Cypher 88) 7440-22-4 Silver powder (Cypher 88)

银粉(Cypher 88) 7440-22-4 Silver powder (Cypher 88)

铕溅射靶材, 50.8mm dia x 3.18mm thick 7440-53-1 Europium sputtering target, 50.8mm dia x 3.18mm thick

铂, 5% 负载于二氧化硅 Platinum, 5% on silica

钌, 5% 负载于二氧化硅 Ruthenium, 5% on silica

钯, 5% 负载于二氧化硅 Palladium, 5% on silica

铑箔, 0.025mm (0.001in)厚, 99.8% (metals basis) 7440-16-6 Rhodium foil, 0.025mm (0.001in) thick, 99.8%

铕溅射靶材, 50.8mm dia x 1.59mm thick 7440-53-1 Europium sputtering target, 50.8mm dia x 1.59mm thick

金箔微件 Gold leaf micropieces

锡铋金锭 Tin Bismuth Gold ingot

光学助熔剂 125, 51% 四硼酸锂, 27% 偏硼酸锂, 12% 氧化镧, 10% 氟化锂, 熔凝 Spectroflux 125, 51% Lithium tetraborate, 27% L